|
|
Chip Quik, Inc. |
HEAT SINK THERMAL COMPOUND - DEE |
1 |
|
30
In-stock
|
Obtener cotización
|
|
|
|
MG Chemicals |
HEAT TRANS COMPOUND SILICONE |
1 |
|
54
In-stock
|
Obtener cotización
|
|
|
|
MG Chemicals |
ADHESIVE - THERMAL CONDUCTIVE EP |
1 |
|
6,500
In-stock
|
Obtener cotización
|
|
|
|
Parker Chomerics |
THERM-A-GAP GEL 37 3.7 W/M-K DIS |
1 |
|
85
In-stock
|
Obtener cotización
|
|
|
|
MG Chemicals |
GREASE CARBON ELEC CONDUCT 2.8OZ |
1 |
|
32
In-stock
|
Obtener cotización
|
|
|
|
Parker Chomerics |
THERM-A-GAP T630 0.7W/M-K 10CC |
1 |
|
91
In-stock
|
Obtener cotización
|
|
|
|
ACL Staticide, Inc. |
HEAT SINK GREASE |
1 |
|
86
In-stock
|
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|
|
|
|
3M |
SILICONE PASTE 8 OZ CLEAR |
1 |
|
21
In-stock
|
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|
|
|
MG Chemicals |
FAST CURE THERM COND ADH FLOW |
1 |
|
18
In-stock
|
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|
|
|
|
Chip Quik, Inc. |
HEAT SINK THERMAL COMPOUND - DEE |
1 |
|
20
In-stock
|
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|
|
|
|
Parker Chomerics |
T670 3W/M-K GREASE 1.4CC VIAL |
1 |
|
45
In-stock
|
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|
|
|
|
T-Global Technology |
NON-SILICONE THERMAL PUTTY 30CC |
1 |
|
44
In-stock
|
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|
|
|
|
Chip Quik, Inc. |
HEAT SINK COMPOUND - GREY ULTRA |
1 |
|
8
In-stock
|
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|
|
|
|
Chip Quik, Inc. |
HEAT SINK COMPOUND - HIGH DENSIT |
1 |
|
10
In-stock
|
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|
|
|
|
T-Global Technology |
SILICONE PUTTY IN 30CC SYRINGE |
1 |
|
34
In-stock
|
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|
|
|
|
Wakefield Thermal |
ULTIMIFLUX GEL 10CC SYRINGE 3.5W |
1 |
|
11
In-stock
|
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|
|
|
|
Chip Quik, Inc. |
HEAT SINK THERMAL COMPOUND - DEE |
1 |
|
8
In-stock
|
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|
|
|
|
Aavid |
THERMALBOND EPOXY 7OZ PACKET |
1 |
|
24
In-stock
|
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|
|
|
|
Laird - Performance Materials |
TPUTTY 403 SYRINGE 30CC |
1 |
|
41
In-stock
|
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|
|
|
|
Laird - Performance Materials |
TPUTTY 403 75CC CARTRIDGE |
1 |
|
31
In-stock
|
Obtener cotización
|
