|
|
Shiu Li Technology |
TWO-PART EPOXY THERMAL SEALING, |
1 |
|
378
In-stock
|
Obtener cotización
|
|
|
|
MG Chemicals |
SLOW CURE THERM COND ADH FLOW |
1 |
|
40
In-stock
|
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|
|
|
|
MG Chemicals |
THERMAL ADHESIVE 50ML |
1 |
|
144
In-stock
|
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|
|
|
|
3M |
ADHESIVE THERM COND 50ML |
1 |
|
188
In-stock
|
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|
|
|
|
MG Chemicals |
THERMALLY CONDUCTIVE EPOXY |
1 |
|
23
In-stock
|
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|
|
|
|
Wakefield Thermal |
TOUGHENED, FLEXIBLE ADHESIVE SYS |
1 |
|
94
In-stock
|
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Wakefield Thermal |
NON-SAG 5 MINUTE BONDATHERM EPOX |
1 |
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49
In-stock
|
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|
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|
MG Chemicals |
FAST CURE THERM COND ADH FLOW |
1 |
|
18
In-stock
|
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|
|
|
|
Wakefield Thermal |
ALUMINUM FILLED BONDATHERM EPOXY |
1 |
|
70
In-stock
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Wakefield Thermal |
FAST CURING THERMALLY CONDUCTIVE |
1 |
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20
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Henkel/Loctite |
EPOXY ENCAPSULANT 18 LB GALLON |
1 |
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10
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Wakefield Thermal |
FAST CURING THERMALLY CONDUCTIVE |
1 |
|
6,500
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MG Chemicals |
ADHESIVE - THERMAL CONDUCTIVE EP |
1 |
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6,500
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MG Chemicals |
THERMAL ADHESIVE 25ML |
1 |
|
6,500
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|
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|
3M |
ADHESIVE 2-PART EPOXY 50ML |
1 |
|
6,500
In-stock
|
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|
|
|
Wakefield Thermal |
5 MINUTE CLEAR BONDATHERM EPOXY |
1 |
|
40
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|
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|
MG Chemicals |
SLOW CURE THERM COND ADH FLOW |
1 |
|
12
In-stock
|
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|
|
|
|
MG Chemicals |
FAST CURE THERM COND ADH FLOW |
1 |
|
6,500
In-stock
|
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|
|
|
|
Wakefield Thermal |
SILVER FILLED BONDATHERM 2 GRAM |
1 |
|
6,500
In-stock
|
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|
|
|
Wakefield Thermal |
FAST CURING ALUMINUM FILLED BOND |
25 |
|
6,500
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|
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|
