- Attachment Method:
-
- Material:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
5 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | 1 |
2,121
In-stock
|
Obtener cotización | |||
![]() |
CUI Devices | 1 |
2,870
In-stock
|
Obtener cotización | |||
![]() |
CUI Devices | 1 |
72
In-stock
|
Obtener cotización | |||
![]() |
CUI Devices | 1 |
6,500
In-stock
|
Obtener cotización | |||
![]() |
CUI Devices | 4,000 |
6,500
In-stock
|
Obtener cotización |