Package Cooled:
Thermal Resistance @ Forced Air Flow:
Imagen Parte Fabricante Descripción MOQ Valores Acción
HSE-B18254-0396H CUI Devices
HEAT SINK, EXTRUSION,TO-218, 25.
18
6,500
In-stock
Obtener cotización
HSE-B20508-035H-01 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
1,800
6,500
In-stock
Obtener cotización
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