Thermal Resistance @ Forced Air Flow:
Imagen Parte Fabricante Descripción MOQ Valores Acción
HSE-B18254-035H-00 CUI Devices
HEAT SINK, EXTRUSION, TO-218, 25
74
6,500
In-stock
Obtener cotización
HSE-B18317-035H-01 CUI Devices
HEAT SINK, EXTRUSION, TO-218, 31
1,500
6,500
In-stock
Obtener cotización
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