- Fabricante：
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- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Natural：
-
7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
6,500
In-stock
|
Obtener cotización | |||
|
|
CUI Devices | 1,800 |
6,500
In-stock
|
Obtener cotización | |||
|
|
TE Connectivity AMP Connectors | 1 |
6,500
In-stock
|
Obtener cotización | |||
|
|
TE Connectivity AMP Connectors | 1 |
6,500
In-stock
|
Obtener cotización | |||
|
|
TE Connectivity AMP Connectors | 1 |
6,500
In-stock
|
Obtener cotización | |||
|
|
TE Connectivity AMP Connectors | 1 |
6,500
In-stock
|
Obtener cotización | |||
|
|
TE Connectivity AMP Connectors | 1 |
6,500
In-stock
|
Obtener cotización |