- メーカー：
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- Attachment Method：
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- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
11 記録
| 画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | 1 |
2,938
In-stock
|
見積もりを取る | |||
|
|
ASSMANN WSW Components | 1 |
989
In-stock
|
見積もりを取る | |||
|
|
ASSMANN WSW Components | 1 |
250
In-stock
|
見積もりを取る | |||
|
|
ASSMANN WSW Components | 1 |
102
In-stock
|
見積もりを取る | |||
|
|
ASSMANN WSW Components | 1 |
1,363
In-stock
|
見積もりを取る | |||
|
|
ASSMANN WSW Components | 1 |
90
In-stock
|
見積もりを取る | |||
|
|
ASSMANN WSW Components | 1 |
89
In-stock
|
見積もりを取る | |||
|
|
NTE Electronics, Inc. | 1 |
240
In-stock
|
見積もりを取る | |||
|
|
ASSMANN WSW Components | 1 |
32
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 4,000 |
6,500
In-stock
|
見積もりを取る | |||
|
|
CUI Devices | 3,000 |
6,500
In-stock
|
見積もりを取る |