- メーカー：
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- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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275 記録
| 画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
|---|---|---|---|---|---|---|---|
|
Adafruit | 1 |
1,347
In-stock
|
見積もりを取る | |||
|
|
T-Global Technology | 1 |
72
In-stock
|
見積もりを取る | |||
|
|
DFRobot | 1 |
466
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
1,599
In-stock
|
見積もりを取る | |||
|
|
Seeed | 1 |
327
In-stock
|
見積もりを取る | |||
|
|
Seeed | 1 |
235
In-stock
|
見積もりを取る | |||
|
|
Trenz Electronic | 1 |
127
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
132
In-stock
|
見積もりを取る | |||
|
|
T-Global Technology | 1 |
104
In-stock
|
見積もりを取る | |||
|
|
Adafruit | 1 |
1,492
In-stock
|
見積もりを取る | |||
|
|
Sunon | 1 |
151
In-stock
|
見積もりを取る | |||
|
|
Sunon | 1 |
170
In-stock
|
見積もりを取る | |||
|
|
Wakefield Thermal | 1 |
213
In-stock
|
見積もりを取る | |||
|
|
Seeed | 1 |
194
In-stock
|
見積もりを取る | |||
|
|
Seeed | 1 |
252
In-stock
|
見積もりを取る | |||
|
|
Seeed | 1 |
122
In-stock
|
見積もりを取る | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
273
In-stock
|
見積もりを取る | |||
|
|
NTE Electronics, Inc. | 1 |
1,000
In-stock
|
見積もりを取る | |||
|
|
T-Global Technology | 1 |
158
In-stock
|
見積もりを取る | |||
|
|
OSEPP Electronics | 7 |
605
In-stock
|
見積もりを取る |