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MUC-CHIP
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Contents:
  • 3D Printed Shell, Board, Bluetooth Module, Cable(s), Chassis, Components, Hardware, Sensor(s), Switch, Wheels (1)
  • Board, Sensor (1)
Utilized IC / Part:
  • AK09918C, CH-101/102, HVC4223F, ICM,-42688, ICP-10111, ICS-43434, SAME70Q21B (1)
  • SAME70Q21B (1)
Filter:
  • Robotics Kits
  • TDK InvenSense
2 Records
Image Part Manufacturer Description MOQ Stock Action
TDK_ROBOKIT1-DK
TDK_ROBOKIT1-DK
TDK InvenSense
ROBOKIT EVAL BOARD
1
PDF
38
In-stock
Get Quote
TDK_ROBOKIT1
TDK_ROBOKIT1
TDK InvenSense
ROBOKIT ROBOT PLATFORM
1
PDF
9
In-stock
Get Quote
TDK_ROBOKIT1-DK
TDK_ROBOKIT1-DK
TDK InvenSense
ROBOKIT EVAL BOARD
Stock : 38
RFQ
TDK_ROBOKIT1
TDK_ROBOKIT1
TDK InvenSense
ROBOKIT ROBOT PLATFORM
Stock : 9
RFQ
1 / 1 Page, 2 Records
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