Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Bild Del Tillverkare Beskrivning MOQ Stock Handling
HSE-B18254-0396H CUI Devices
HEAT SINK, EXTRUSION,TO-218, 25.
18
6,500
In-stock
Få offert
HSE-B18381-0396H CUI Devices
HEAT SINK, EXTRUSION, TO-218, 38
1,350
6,500
In-stock
Få offert
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