- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
2 Uppgifter
| Bild | Del | Tillverkare | Beskrivning | MOQ | Stock | Handling | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
605
In-stock
|
Få offert | |||
|
|
CUI Devices | 1,000 |
6,500
In-stock
|
Få offert |