- Tillverkare：
-
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
4 Uppgifter
| Bild | Del | Tillverkare | Beskrivning | MOQ | Stock | Handling | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
2,355
In-stock
|
Få offert | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
683
In-stock
|
Få offert | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
301
In-stock
|
Få offert | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
822
In-stock
|
Få offert |