- Tillverkare：
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- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Uppgifter
| Bild | Del | Tillverkare | Beskrivning | MOQ | Stock | Handling | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 5,400 |
6,500
In-stock
|
Få offert | |||
|
|
CUI Devices | 1,500 |
6,500
In-stock
|
Få offert | |||
|
|
Wakefield Thermal | 180 |
6,500
In-stock
|
Få offert |