Termisk - Dynor, lakan

Filtrera：

2 Uppgifter

Bild	Del	Tillverkare	Beskrivning	MOQ		Stock	Handling
	AF500-265005	CUI Devices	THERM PAD 26.25MMX50MM 1 SH=64PC	1	PDF	4 In-stock	Få offert
	SF500-265005	CUI Devices	THERMAL INTERFACE MATERIAL, SF50	21	PDF	6,500 In-stock	Få offert

1 / 1 Page, 2 Records

Din trogna leverantörskedja för elektroniska komponenter

Building D, Juji Industrial Zone, Xueziwei, Yabian Community, Shajing Street, Baoan District, Shenzhen, China
+86-755-23082104
sales@muc-chip.com