- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
1,944
In-stock
|
Obtener cotización | |||
|
|
CUI Devices | 1 |
1,433
In-stock
|
Obtener cotización | |||
|
|
CUI Devices | 1 |
605
In-stock
|
Obtener cotización | |||
|
|
CUI Devices | 33 |
6,500
In-stock
|
Obtener cotización | |||
|
|
CUI Devices | 1,500 |
6,500
In-stock
|
Obtener cotización |