- メーカー:
-
- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
951 記録
画像 | 部 | メーカー | 説明 | MOQ | ストック | アクション | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions, Inc. | 1 |
696
In-stock
|
見積もりを取る | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
543
In-stock
|
見積もりを取る | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
414
In-stock
|
見積もりを取る | |||
![]() |
Advanced Thermal Solutions, Inc. | 1 |
135
In-stock
|
見積もりを取る | |||
![]() |
ASSMANN WSW Components | 1 |
53,181
In-stock
|
見積もりを取る | |||
![]() |
ASSMANN WSW Components | 1 |
2,598
In-stock
|
見積もりを取る | |||
![]() |
ASSMANN WSW Components | 1 |
4,077
In-stock
|
見積もりを取る | |||
![]() |
CUI Devices | 1 |
3,205
In-stock
|
見積もりを取る | |||
![]() |
ASSMANN WSW Components | 1 |
2,403
In-stock
|
見積もりを取る | |||
![]() |
ASSMANN WSW Components | 1 |
5,602
In-stock
|
見積もりを取る | |||
![]() |
CUI Devices | 1 |
3,326
In-stock
|
見積もりを取る | |||
![]() |
ASSMANN WSW Components | 1 |
4,287
In-stock
|
見積もりを取る | |||
![]() |
CUI Devices | 1 |
1,287
In-stock
|
見積もりを取る | |||
![]() |
CUI Devices | 1 |
1,713
In-stock
|
見積もりを取る | |||
![]() |
ASSMANN WSW Components | 1 |
1,280
In-stock
|
見積もりを取る | |||
![]() |
CUI Devices | 1 |
1,689
In-stock
|
見積もりを取る | |||
![]() |
Watterott electronic | 1 |
6,673
In-stock
|
見積もりを取る | |||
![]() |
ASSMANN WSW Components | 1 |
18,481
In-stock
|
見積もりを取る | |||
![]() |
Wakefield Thermal | 1 |
7,531
In-stock
|
見積もりを取る | |||
![]() |
CUI Devices | 1 |
5,589
In-stock
|
見積もりを取る |